Wafer

1.Lithography
2.Metalization
3.Dry and wet etching
4.Diffusion and oxidation
5.Lapping and breaking
6.Wafer and chip testing

Total Area: 800 sq. m.
Production Staff: 40
Engineer Staff: 20

1.III- V optoelectronics ODM / OEM / foundry service.
2.Proven volume production
3.Continuous yield improvement
4.Configured for process versatility
5.High flexibility, high reliability, competitive, high performance, good collaboration.
6.ISO 9000 certified