Company Profile Corporate Executives Organization Milestone Manufacturing Capacity QMS and ESH

As one of major active optical components supplier in Asia, TrueLight Corporation committed to design and develop optoelectronic semiconductor and optic technology for past twenty years. We provide mass production products to meet increasing bandwidth requirements for optical fiber interconnection, superior Vertical Cavity Surface Emitting Lasers (VCSELs) for sensing applications in smartphone.
Our product portfolio is served and partnered to optical fiber transceiver manufacturer、internet equipment manufacturer and smartphone module manufacturer.
TrueLight's next-generation products include high-bandwidth semiconductor lasers、photodiodes components and submodules、optical engine、active optical cable 、 VCSEL Light source for cloud/data center、5G mobile internet base station interconnection and proximity/flood illumination/3D sensing in smartphone.
Job Title Name
Chairman Taiwan Mask Corporation Representative:Lidon Chen
President MY Chu
Director of Finance Div. Adam Wu
Executive Vice President C.Z. Wu
V.P. of R&D Div. C.C. Chen
Senior Director of Sales & Marketing Div. Vichy Ou
Senior Director of Manufacturing Div. June Han Wu
organization

TrueLight

Year Milestone Project
Y2024 Successfully developed:
200G and 400G high-speed pluggable optical transceiver modules.
SWIR 1130nm VCSEL and PD components for shortwave infrared applications.
Y2023 Successfully developed:
QSFP-DD SR8 (for optical modules designed to support 400G Ethernet, suitable for data center links up to 100m over multi-mode fiber with FEC).
56G APD-TIA ROSM (for high-speed transmission).
Successfully developed 1310nm PD with low visible light interference (proximity sensor for smartphone).
Y2022 Successfully developed:
Mid-power O-band laser components (for cloud data centers).
56G GaAs, 56G InGaAs, and 56G DFB photonic components (for cloud data centers).
940nm small angle (20 degree) oxide VCSEL components.
Development of 850nm 56G PAM4 VCSEL components.
850nm 32Gps industrial-grade VCSEL chip (Rms<0.45nm).
Y2021 Successfully developed:
CoC/CoB Submodules for Cloud computing and Data center application, enhancing operational scale.
850/940nm single-mode, single-polarization VCSELs for precision sensing markets.
Development of high-efficiency VCSEL epitaxial wafers and components with small divergence angles (15-18°).
Y2020 Successfully developed:
Integrated VCSELs for optical communications into our own epitaxial wafers, expanding production capacity.
128 Gbps VCSEL for high-speed data centers and high-security data preservation markets.
25 Gbps 1270/ 1290/ 1310/ 1330/ 1350/ 1370nm industrial-grade DFB lasers, part of a comprehensive color light solution for 5G base station transmission.
High-power 2W/ 4W VCSEL arrays for ToF sensing applications, such as in the next generation of Apple smartphones, setting a standard for camera accessories and driving adoption by other smartphone manufacturers.
Y2019 Successfully developed epitaxial wafers for consumer applications, integrated consumer VCSELs into TL's epitaxial wafers, and expanded production capacity.
Y2018 Successfully developed a series of 3D sensing transmitter module products, including the 40Gbps SR4 QSFP+ (Quad Small Form-factor Pluggable) and 100G QSFP28 SR4 COB series products, further increasing operation scale.
Y2017 Implemented advanced wafer fabrication process technology and equipment to enhance product manufacturing and production capacity.
Implemented MOCVD (Metal-organic Chemical Vapor Deposition) production technology to enhance product research and development as well as manufacturing capabilities.
Successfully developed the CoS (chip-on-submount) series products, featuring in-house VCSEL epitaxial wafers and high-efficiency VCSEL components, applied in consumer-grade 3D sensing products.
Y2016 Expanded the OSA Subassembly and packaging production line, increasing production capacity.
Implemented COB (chip-on-board) production technology and successfully developed a series of components for VR/HMD (Virtual Reality /Head Mount Display) applications, Further increasing operation capacity.
Y2015 Expanded wafer fabrication and assembly production lines, increasing production capacity.
Introduced modules of finger point /vein biometric product and implemented Shrink Epitaxy Top InP process., increasing production capacity.
Developed new process technologies for optical communication components and a series of laser distance sensor series products for mobile communication applications, further enhancing operational scale.
Y2014 Expanded the capacity of TO-56 assembly production lines.
Scale expansion by introduced the OEM/ODM of 40G QSFP, 10Gbps VCSEL TOSM and APDTIA TO-Can series products.
Successfully developed the PINTIA DC/AC automatic feeding testing machine, the QC VCSEL testing automation machine, the APD testing automatic alignment light coupling machine, and the TO-Can Lens automatic inspection machine.
Began mass production of 10Gbps 1310nm Fabry-Perot Edge-Emitting Lasers, 1.25Gbps 4QW FP LD devices and assembly (for EPON applications) series products.
Y2013 Obtained certifications for "TIPS:2007 Taiwan Intellectual Property Management Specification" and "IECQ QC 080000 Electronic and Electrical Components and Products Hazardous Substance Process Management System".
Secured government incentives of Advanced Technology Development Project from Central Taiwan Science Park (Project of finger point /vein biometric module development).
Expanded TO assembly production lines to increase production capacity.
Introduced G-PON DFB TO-Can (ODM/OEM), 40Gbps SR4 chip-on-board (COB), 10Gbps InGaAs PINTIA LC ROSM (for LR application), and 10Gbps GaAs PINTIA LC ROSM (for SR application) series products, enhancing operational scale.
Introduced 10Gbps 1310nm/1270nm DFB Lasers, 14Gbps GaAs PIN components, and 320x256 2D InGaAs array (for IR sensor applications) products.
Successfully developed manual testing machines for FFP Edge-emitting lasers, simplified automatic appearance inspection testing machines for chip visual inspection, and the auto tester for SMSR of DFB lasers.
Began mass production of 5Gbps Analog PD pigtail module and 6Gbps 1310nm LD pigtail module series products.
Y2012 Introduced the InGaAs PINTIA TO series products for 3G LTE application to Korea market.
Began mass production of 1310nm High Power FP LD Chip/TO、8G GaAs PINTIA ROSM (for SR Application) series.
Y2011 Stock began trading on Taiwan Stock Exchange: 3234.TW
BOD resolved cash capital increase for the 2 subsidiaries, BOSA Tech and ProRay Limited. BOD resolved to establish the remuneration committee.
Began mass production of 10Gbps GaAs PINTIA TO-CAN assembly, OSA, pigtail, Near infrared high speed photodiode array and APD chips.
Y2010 Began mass production of FP LD series.
Y2009 Setup H.K. ProRay Limited and approved its reinvestment in ProRay limited Zhuhai, China.
Expanded LD TO assembly production lines to increase production capacity.
OHSAS 18001 (Occupational Safety and Health System) and TOSHMS (Taiwan Occupational Safety and Health Management System) Certificate approved.
Introduced FP LD TO-Can for E-PON and Ethernet/SONET application.
Y2008 BOD approved the setup of China subsidiary thru OBU.
Expanded FP LD chip, DFB LD chip production lines, and TO assembly production lines to increase production capacity.
Y2006 Introduced the components of Laser mouse in CE (Consumer Electronics) market, enhancing operational scale.
Y2005 ISO 14001 EMS International Certification.
Began mass production of OSA outsourcing to expand the business scale.
Y2004 TL obtained opinion book of "Technology-Based Enterprise with Successful Product or Technique Development and Marketing Potential" from Industrial Development Bureau, Ministry of Economic Affairs.
Disposed the Shanghai subsidiary.
Established a new OSA production line, expanding production capacity.
Y2003 Listed on Taiwan OTC Market (Stock Code: 3234).
1st year to break even, and turned loss to profit.
Y2002 Became a public listing company in Taiwan Emerging Stock Market.
The Shanghai subsidiary setup.
Became the main PINTIA supplier of FTTH/FTTx market.
Y2001 ISO 9001 QMS International Certification.
Capacity expansion by new TO-Can production line setup.
Introduced VCSEL/PIN for SAN/Ethernet products for the US market.
Y2000 Procurement of the building at Hsinchu Science Park.
The VCSEL (Vertical-Cavity Surface-Emitting Laser) received the 2000 Taiwan Outstanding Optoelectronic Product Award.
Mass production of VCSEL and PIN series products (Chip, TO-Can).
Y1999 Obtained the permission and began operations in the factory.
Introduced VCSEL-based 100M Transceiver products.
Y1998 TL moved into the Hsinchu Science Park, set up a semiconductor wafer fabrication plant, became the first company in Taiwan to sell VCSELs.
Y1997 TrueLight (TL) was established in ITRI (Industrial Technology Research Institute) Incubation Center with an initial Paid-in capital of 30 million NTD.
TrueLight

TrueLight is a professional manufacturer of III-V optoelectronic semiconductor components. Product range includes VCSEL, FP, DFB, PD, APD, Power GaN etc. For use in Optical communications, Consumer electronics, Sensing, and Power electronics applications.
TrueLight possesses production capabilities in MOCVD epitaxy, wafer fabrication, packaging, and submodule assembly:
  1. MOCVD Epitaxy: Capabilities include the epitaxial growth of VCSEL, Power GaN, and RF GaN.
  2. Wafer Fabrication: Capabilities include the production of VCSEL, FP, DFB, PD, APD, SOA, EML, and other components.
  3. Packaging: Capabilities include packaging in TO-38, TO-46, TO-56, COC and COB etc.
  4. Submodule Assembly: Capabilities include glue-sealed and laser-welded transceiver submodules, OSA, OSM, and other assemblies.
TrueLight

The factory tour is divided into four parts:
MOCVD epitaxy, wafer fabrication, packaging, and submodule assembly, showcasing TrueLight's production and manufacturing capabilities.
GaN HEMT Epiwafer
  1. GaN HEMT on SiC: Best for superior performance RF power amplifier applications.
  2. GaN HEMT on Sapphire: Ideal material for Power device and High Frequency device fabrication. Available on 4-in and 6-in substrates.
  3. GaN HEMT on Si: Suitable for both Power and RF device fabrication.
  4. Customize structure Epitaxy Service.
High mobility and low Rs
GaN High mobility and low Rs GaN High mobility and low Rs Hall

High crystalline quality GaN materials and low dislocation density
GaN High crystalline quality GaN materials and low dislocation densit GaN High crystalline quality GaN materials and low dislocation densit structure

High precise dopant control and low impurity
GaN High crystalline quality GaN materials and low dislocation densit GaN High crystalline quality GaN materials and low dislocation densit
GaN High crystalline quality GaN materials and low dislocation densit

VCSEL Epiwafer
  1. 850nm VCSEL for optical fiber communication and consumer application.
  2. 940nm VCSEL for high power and consumer application.
  3. 980nm VCSEL for optical fiber communication and consumer application.
  1. VCSEL/FP/DFB/EML/PD/APD/SOA for fiber optical communication, high power and consumer application.
  2. III- V optoelectronics ODM / OEM / wafer process foundry service.
  3. Proven volume production worthy.
  4. Configured for process versatility.
  5. Adequate flexibility and capacity, high reliability.
  6. ISO 9000 certified.

  1. Wafer Size: 2", 3" and 4"
  2. Capacity: 1200 pcs/month
  3. Product type:
    1. 2", 3", 4" FP/DFB/EML/SOA and high power EEL
    2. 2", 3", 4" GaAs/InGaAs PD & InGaAs APD
    3. 4" VCSEL
  4. Testing Equipment:
    1. CW/pulse mode bar tester and chip tester
    2. C-V tester, I-V tester

Photolithography黃光

  1. Stepper(4")/Aligner(2-4")
  2. Coater/Developer
  3. Oxygen free air oven
  4. CD-SEM//Surface profiler
  5. Thin film measurement

Etching蝕刻

  1. Dry etching RIE/ICP
  2. Wet semiauto etcher
  3. UV-Ozone
  4. Auto Lift off/PR Stripper
  5. α-Step surface profiler

Thin film薄膜

  1. PECVD
  2. Metal evaporation
  3. Sputter
  4. Optical coating
  5. Autocatalytic gold plating

Furnace爐管

  1. Oxidation/Diffusion/Anneal furnace tube
  2. Automatic oxidation process machine
  3. RTA

Lapping研磨

  1. Bonder
  2. Lapper
  3. Polisher
  4. Thickness measurement system

Saw切割

  1. Laser saw
  2. Scriber & breaker
  3. Dicing saw

Test測試

  1. LIV tester and IV tester
  2. C-V tester
  3. Wavelength and spectrum tester
  4. Pulsed LIV and pulsed spectrum tester

Sorting/VI挑揀/目檢

  1. Sorter
  2. AOI
  3. OM

Line width 0.5um
Wafer Process Line Width 0.5um CD-SEM instrument
Wafer Process CD SEM Instrument
Stepper(4")
Wafer Process Stepper Coater-Developer
Wafer Process Coater Developer
Thin film measurement
Wafer Process Thin Film Measurement Contact aligner(2"~4")
Wafer Process Contact Aligner
  1. Solid process control.
  2. Capabilities: TO-56, TO-46, TO-38.
  3. High assembly yield.
  4. Fully automated equipment with high throughput, stability, and reliability.

TO-Can Packaged
TO Can Die bonding TO Can Die bonding
Die bonding
TO Can Die bonding TO Can Die bonding Wire bonding
TO Can Wire bonding TO Can Wire bonding
Bonding
TO Can Cap TO Can bonding Cap welding
TO Can Cap welding TO Can Cap welding
Burn-in
TO Can Burn in Testing
TO Can Testing TO Can Testing
  1. High assembly accuracy.
  2. High frequency circuits design and simulation capability.
  3. Firmware and GUI capability.
  4. High speed test capability.
  5. Provide ODM / OEM service.

Chip Design/Manufacture

  1. 10/25Gb, 28GB VCSEL/PD chip design
  2. Sorted Chip for IT/Long distance (low RMS) application

High Assembly Accuracy

  1. Die Bond accuracy (<5um)
  2. Wire Bond accuracy (<3um)
  3. Active and passive Lens Bond

COB

High-frequency Circuits Design and Simulation Capability

  1. Pre-SI and Post-SI simulation for PCB design
  2. 3D package SI simulation capability
  3. OEM/ODM capability
COB

Firmware & GUI

  1. Compliance with SFF-8636 or CMIS
  2. GUI for Module development and production
  3. Support customized design

High Speed Test Capability

  1. 10/25Gb optical and electrical eye measure
  2. 10/25Gb, 28GB BERT test
  3. 3T AC test equipment

COB COB
  1. Automated Optical Coupling and Testing Equipment.
  2. Suitable for operational and high-temperature applications.
  3. Production of ANSI/ESD-S20-20 compliant ESD environmental specifications.

Glue Curing Technology
OSA Optical Sub Assembly LC OSA Automated Glue Dispenser OSA Automated Optical Coupling
Laser Welding Technology
OSA Optical Sub Assembly SC OSA Laser Welding TO Can Die bonding
TrueLight

Quality and HSF Policy
  1. Maintaining a quality management system that includes effective and continuous improvement of HSF and its performance.
  2. Provide customers the product quality that 100% conforms with the request from HSF and government.
Policy of H&S and Environmental Protection
  1. To Conform to the H&S (health and safety) and environmental protection policies / regulations / other requirements of government and local administration, and the H&S and environmental protection requirements of the relevant associations; to persist in promoting the H&S and environmental protection by developing the related method / SOP.
  2. To research and produce friendly products with minimum impacts / burdens on the environment and to promote the pollution prevention, industrial waste decrease and energy saving activities.
  3. To guarantee employee's H&S is the certain duty and responsibility of the superintendents at all levels.
  4. To monitor / control the environmental impacts and H&S risks on the surrounding during company's activities and services; to reduce operation hazards (including injury and illness prevention), and properly revise the related goal, target and project of environmental H&S. Keep improving the achievements of H&S management and environmental protection and a good relationship and communication with neighbors.
  5. To provide proper training and promotion to have all of employees to understand the policies and know the personal duty of the H&S and environmental protection, and construct a good communication gateway to encourage employees to provide the suggestion about the H&S and environmental protection and join related activities.
Green products
TrueLight has been dedicated to developing optical products in compliance with the requirements of the regulatory standard EU directive 2011/65/EU and 1907/2006/EC.

Quality and HSF Management
-Production Quality Monitor by SPC.
-Incoming Material HSF Monitor by XRF.
-Third party laboratory accreditation annually.
-Green partner and supply chain.

Conflict Minerals Policy
TrueLight Technology Co.,Ltd is taking and will take due diligence within our supply chain to assure “DRC Conflict-Free” for the Minerals of gold (Au), tantalum (Ta), tungsten (W), cobalt(Co) and tin (Sn) are not derived from or sourced from mines in conflict areas of the Democratic Republic of Congo (DRC), or illegally taxed on trade routes, either of which are controlled by non-governmental military groups, or unlawful military factions.

TrueLight Technology Co.,Ltd hereby formulated this Conflict Minerals Policy and makes following commitments:

  1. Not use the conflict minerals originated from the Democratic Republic of the Congo (DRC) and its adjoining countries.
  2. Request our suppliers to follow Minerals Conflict-Free requirements.
  3. Continuing our industry leadership and our efforts to source conflict-free minerals from the DRC where possible and agree to compliance with Responsible Business Alliance (RBA) Code of Conduct.
Management System Certificate
ISO 9001 : 2015
Quality Management system

COB
Certificate Date：2001/09/19
Valid Date：2027/07/08 ISO 14001 : 2015
Environmental Management System
COB
Certificate Date：2005/07/14
Valid Date：2027/07/08 IECQ QC080000 : 2017
Hazardous Substance Process Management System
COB
Certificate Date：2013/08/23
Valid Date：2025/08/27

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