Successfully developed

• 660nm VCSELs for medical sensing applications.
• High-precision packaging (silicon photonics) and optical、mechanical、electrical、 software and firmware integration technology foundry services.

• 400G QSFP56-DD SR8 and 800G QSFP-DD SR8/1.6T products.

Successfully developed

• 200G and 400G high-speed pluggable optical transceiver modules.
• SWIR 1130nm VCSEL and PD components for shortwave infrared applications.

Successfully developed

• QSFP-DD SR8 (for optical modules designed to support 400G Ethernet, suitable for data center links up to 100m over multi-mode fiber with FEC).
• 56G APD-TIA ROSM (for high-speed transmission).
• Successfully developed 1310nm PD with low visible light interference (proximity sensor for smartphone).

Successfully developed

• Development of 850nm 56G PAM4 VCSEL components.
• 850nm 32Gps industrial-grade VCSEL chip (Rms<0.45nm).
• Mid-power O-band laser components (for cloud data centers).
• 56G GaAs, 56G InGaAs, and 56G DFB photonic components (for cloud data centers).
• 940nm small angle (20 degree) oxide VCSEL components.

Successfully developed

• CoC/CoB Submodules for Cloud computing and Data center application.
• 850/940nm single-mode, single-polarization VCSELs for precision sensing markets.
• Development of high-efficiency VCSEL epitaxial wafers and components with small divergence angles (15-18°).

Successfully developed

• Integrated VCSELs for optical communications into our own epitaxial wafers.
• 128Gbps VCSEL for high-speed data centers and high-security data preservation markets.
• 25Gbps 1270/1290/1310/1330/1350/1370nm industrial-grade DFB lasers, part of a comprehensive color light solution for 5G base station transmission.
• High-power 2W/4W VCSEL arrays for ToF sensing applications, such as in the next generation of Apple smartphones.

Successfully developed

• Epitaxial wafers for consumer applications.
• Integrated consumer VCSELs into TL's epitaxial wafers.

Successfully developed

• Series of 3D sensing transmitter module products.
• 40Gbps SR4 QSFP+ (Quad Small Form-factor Pluggable) and 100G QSFP28  SR4 COB series products.

• Implemented advanced wafer fabrication process technology and equipment to enhance product manufacturing and production capacity.
• Implemented MOCVD (Metal-organic Chemical Vapor Deposition) production technology.
• Successfully developed the CoS (chip-on-submount) series products.
• Featuring in-house VCSEL epitaxial wafers and high-efficiency VCSEL components, applied in consumer-grade 3D sensing products.

• Expanded the OSA Subassembly and packaging production line.
• Implemented COB (chip-on-board) production technology and successfully developed a series of components for VR/HMD (Virtual Reality/ Head Mount Display) applications.

• Expanded wafer fabrication and assembly production lines.
• Introduced modules of finger point/ vein biometric product and implemented Shrink Epitaxy Top InP process.
• Developed new process technologies for optical communication components and a series of laser distance sensor series products for mobile communication applications.

• Expanded the capacity of TO-56 assembly production lines.
• Introduced the OEM/ODM of 40G QSFP, 10Gbps VCSEL TOSM and APDTIA TO-Can series products.
• Successfully developed the PINTIA DC/AC automatic feeding testing machine, the QC VCSEL testing automation machine, the APD testing automatic alignment light coupling machine, and the TO-Can Lens automatic inspection machine.
• Began mass production of 10Gbps 1310nm Fabry-Perot Edge-Emitting Lasers, 1.25Gbps 4QW FP LD devices and assembly (for EPON applications) series products.

• Obtained certifications for "TIPS:2007 Taiwan Intellectual Property Management Specification" and "IECQ QC 080000 Electronic and Electrical Components and Products Hazardous Substance Process Management System".
• Secured government incentives of Advanced Technology Development Project from Central Taiwan Science Park (Project of finger point /vein biometric module development).
• Expanded TO assembly production lines.
• Introduced G-PON DFB TO-Can (ODM/OEM).
• Successfully developed the 40Gbps SR4 chip-on-board (COB), 10Gbps InGaAs PINTIA LC ROSM (for LR application), and 10Gbps GaAs PINTIA LC ROSM (for SR application) series products.
• Introduced 10Gbps 1310nm/1270nm DFB Lasers, 14Gbps GaAs PIN components, and 320x256 2D InGaAs array (for IR sensor applications) products.
• Successfully developed manual testing machines for FFP Edge-emitting lasers, simplified automatic appearance inspection testing machines for chip visual inspection, and the auto tester for SMSR of DFB lasers.
• Began mass production of 5Gbps Analog PD pigtail module and 6Gbps 1310nm LD pigtail module series products.

• Introduced the InGaAs PINTIA TO series products for 3G LTE application to Korea market.
• Began mass production of 1310nm High Power FP LD Chip/TO、8G GaAs PINTIA ROSM (for SR Application) series.

• Stock began trading on Taiwan Stock Exchange: 3234.TW
• Began mass production of 10Gbps GaAs PINTIA TO-CAN assembly, OSA, pigtail, Near infrared high speed photodiode array and APD chips.

Successfully developed

• Began mass production of FP LD (Fabry-Perot Laser) series.

• OHSAS 18001 (Occupational Safety and Health System) and TOSHMS (Taiwan Occupational Safety and Health Management System) Certificate approved.
• Expanded LD TO assembly production lines.
• Introduced FP LD TO-Can for E-PON and Ethernet/SONET application.

Successfully developed

• Expanded FP LD chip, DFB LD chip production lines, and TO assembly production lines.

Successfully developed

• Introduced the components of Laser mouse in CE (Consumer Electronics) market.

• ISO 14001 EMS International Certification.
• Began mass production of OSA outsourcing.

• TrueLight obtained opinion book of "Technology-Based Enterprise with Successful Product or Technique Development and Marketing Potential" from Industrial Development Bureau, Ministry of Economic Affairs.
• Established a new OSA production line.

Listed on Taiwan OTC Market.

• Stock Code: 3234

• Became a public listing company in Taiwan Emerging Stock Market.
• Became the main PINTIA supplier of FTTH/FTTx market.

• ISO 9001 QMS International Certification.
• Capacity expansion by new TO-Can production line setup.
• Introduced VCSEL/PIN for SAN/Ethernet products for the US market.

• The VCSEL (Vertical-Cavity Surface-Emitting Laser) received the 2000 Taiwan Outstanding Optoelectronic Product Award.
• Mass production of VCSEL and PIN series products (Chip, TO-Can).

   

• Obtained the permission and began operations in the factory.
• Introduced VCSEL-based 100M Transceiver products.

Establish a wafer processing factory

• Relocate to the Hsinchu Science and Industrial Park (current location).
• Taiwan's first company to sell VCSELs.

_{TrueLight ®  Founded and established}

• Moved into the Industrial Technology Research Institute Incubation Center.