Die Process
Die Testing
Chip probing test results a wafer bin map by photoelectric performance.Each die (chip) on the wafer is tested and classified based on its optoelectronic properties.
Wafer Dicing
Use a die saw or laser beam to separate the wafer into individual dies.
Sorting
Based on the die testing data, the chips are categorized and selected accordingly.
Visual Inspection
To inspect chip defects by microscopes or AIO equipment.
