Wafer Process

Lithography - Mask Aligner Stepper (4")

Achieving more exposure accuracy by using high accuracy optical and step system to move on wafer to process exposure.

Thin film - PECVD

Using plasma to dissociate the reaction gas and cause it to undergo a chemical reaction then deposition on wafer surface to form a thin film.
PECVD: Plasma Enhanced Chemical Vapor Deposition

Etch - Auto Wet Bench

Put the wafer in tank of acid, alkaline or organic solutions, using chemical corrosion to process etching.

Furnace - Vertical Furnace 

Put the wafer in the vertical quartz tube to process oxidation by control temperature and moisture to fine tune.

E-Beam Writer

An E-Beam Writer uses a precisely controlled focused electron beam to directly write pre-designed patterns onto the surface of a wafer coated with an electron resist. The pattern is then transferred to the wafer via etching or deposition processes. This technology is widely used in semiconductor lasers and micro-nano fabrication fields.

Lapping - Wafer Thinning

The process reduces the thickness of the wafer by grinding.