Product

Wafer Process

Product Number:oem-chip
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C1_1DX_4700

Stepper

Achieving more exposure accuracy by using high accuracy optical and step system to move on wafer to process exposure.

C1_1DX_4671 1

PECVD

Using plasma to dissociate the reaction gas and cause it to undergo a chemical reaction then deposition on wafer surface to form a thin film.

C1_1DX_4683 1

化學-自動蝕刻

Put the wafer in tank of acid, alkaline or organic solutions, using chemical corrosion to process etching.

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爐管-垂直式爐管

Put the wafer in the vertical quartz tube to process oxidation by control temperature and moisture to fine tune.

C1_1DX_4707

E-Beam Writer

An e beam writer uses a precisely controlled, focused electron beam to directly write a pre-designed pattern onto a resist-coated wafer surface. This pattern is then transferred onto the wafer through etching or deposition processes. It is widely used in semiconductor laser and micro/nanofabrication.。

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Lapping

The process reduces the thickness of the wafer by grinding.

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